Sony announces industry’s smallest C-mount camera
The industry’s smallest C-mount camera module has been unveiled at the Vision show, Stuttgart by Sony Europe’s Image Sensing Solutions (ISS) division.
The industry’s smallest C-mount camera module has been unveiled at the Vision show, Stuttgart by Sony Europe’s Image Sensing Solutions (ISS) division.
At 19x29x29mm the Micro XCD camera has a footprint smaller than a £2 coin. The module weighs just 37g and is 2/3 the cubic size of previous modules from Sony.
The Micro XCD is available in VGA (60fps) and SXGA (45fps) modules. Data transfer is via IEEE1394b I/F firewire at 1600 Mbps; twice the speed of previous XCD modules from Sony.
The device integrates a high quality 1/3 type CMOS image sensor with the latest FPGA technology; delivering high performance at low power consumption levels.
Sony has taken an innovative approach to design; the number of PCB’s required has been reduced from five to three; and thinner front and rear panels have been incorporated. The result is robust camera with a smaller footprint, making it suited to a wide range of industrial vision applications.
“The key to this breakthrough is the use of CMOS image sensors,” said Myriam Beraneck, marketing manager for machine vision cameras at Sony ISS. “Being small, high quality and affordable the Micro XCD gives an unparalleled level of flexibility to OEMs and system integrators and allows them to scale their vision systems.”
The XCD-MV6 (VGA) will be available for mass production during November 2010. The XCD-SX9 (SXGA) will be available as sample during Q2 CY2010. For more information or a datasheet with technical specifications please contact zone@eu.sony.com, or visit the Sony stand at Vision (Messe Stuttgart, Stand C33 Hall 6).
At 19x29x29mm the Micro XCD camera has a footprint smaller than a £2 coin. The module weighs just 37g and is 2/3 the cubic size of previous modules from Sony.
The Micro XCD is available in VGA (60fps) and SXGA (45fps) modules. Data transfer is via IEEE1394b I/F firewire at 1600 Mbps; twice the speed of previous XCD modules from Sony.
The device integrates a high quality 1/3 type CMOS image sensor with the latest FPGA technology; delivering high performance at low power consumption levels.
Sony has taken an innovative approach to design; the number of PCB’s required has been reduced from five to three; and thinner front and rear panels have been incorporated. The result is robust camera with a smaller footprint, making it suited to a wide range of industrial vision applications.
“The key to this breakthrough is the use of CMOS image sensors,” said Myriam Beraneck, marketing manager for machine vision cameras at Sony ISS. “Being small, high quality and affordable the Micro XCD gives an unparalleled level of flexibility to OEMs and system integrators and allows them to scale their vision systems.”
The XCD-MV6 (VGA) will be available for mass production during November 2010. The XCD-SX9 (SXGA) will be available as sample during Q2 CY2010. For more information or a datasheet with technical specifications please contact zone@eu.sony.com, or visit the Sony stand at Vision (Messe Stuttgart, Stand C33 Hall 6).